Dedicated to advanced packaging
We understand that lithography for advanced packaging is different from lithography for front end wafer processing. Requirements are special and varying. Resist films are both thin and thick. There are thin, thick and warped wafers from different materials, sizes and shapes. All depending on specific use cases. We designed a tool that is flexible and can effectively deal with all these variations and specific needs.
Best-in-class cost of ownership
We are convinced that we offer a cost-effective tool with the highest throughput compared to competition; with high uptime and low maintenance downtime. The best-in-class cost of ownership is realized by our unique optical column, state-of-the-art wafer and reticle handling, and our innovative wafer edge modules.
Revolutionary platform design
We have taken modular design to a new level which yields easy configurable and upgradable tools. In this way, we address all specific needs in advanced packaging. We do not deliver a point-solution but a tool that is capable to address the needs for now and the future.