Lithography

LITEQ 500 System

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Join THE FUTURE OF ADVANCED PACKAGING

LITEQ 500 is a lithography solution dedicated for Advanced Packaging with a lower cost-of-ownership designed to meet the demands of 2.5/3D, Wafer-level packaging, Fan-in, Fan-out, Flip Chip, and relevant applications such as MEMS, LED, CIS, RF, mobile processor, and CPU/GPU.

 

Key applications: Redistribution layer, Cu Bumping, Fan-out Wafer level packaging, MEMS

Key Features & Benefits of the LITEQ 500 projection stepper

  • Up to 1.2µm resolution for Lines/Spaces
  • More than 16µm Usable depth of focus for 2µm (L/S)
  • High Throughput & handling wafer sizes from 100 to 300mm
  • Multi-product reticles masking
  • High-warpage wafer handling
  • Die-shift or rotation correction on reconstructed wafers
  • Die-to-die exposures and overlay measurements
  • Contact-free wafer-edge protection or exposure

General Inquiries

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